Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
- Författare
- (Guest editors Christopher Bailey and Johan Liu.)
- Genre
- Electronic books.
- Språk
- Engelska
| Förlag | År | Ort | Om boken | ISBN |
|---|---|---|---|---|
| Emerald Group Publishing | c2006 | England, Bradford, England | 72 sidor. |